encapsulating material造句
例句与造句
- Based on the over research , three different kinds of encapsulating materials of epoxy resin are performed
在各种不同制备方法研究的基础上，选用不同的改性体系制备出环氧灌封材料，并对其性能作了评价。 - There are some differences between simulation and experiment results in the patterns " distribution scale for there are still some conditions " differences just as characteristics of encapsulated materials and shapes of encapsulated structure
Led结构的参数变化时，模拟曲线的变化趋势与实验情况吻合较好。其中存在的不同和误差必需根据led管型的真实参数适当调整模拟参数和条件解决，有待进一步改进。 - In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs
摘要结合电子封装的现状、电子塑封材料的发展以及电子封装对塑封材料提出的高性能要求，介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景，其包括耐热型液体、含磷三官能团型、有机硅多官能团脂环族环氧树脂。 - Encapsulating materials of epoxy resin are modified with hgh , nano - sio2 and organophilic montmorillonite , in the present investigation , the microstructue , some properties and influence factors about nano - sio2 and organophilic montmorillonite modified encapsulatig materials have been systematically studied using x - ray diffraction , electron microscopy and differential thermal analysis measurement techniques
随着航空、电子等事业的发展，灌封器件的高性能化对灌封材料提出了越来越高的要求。探索制备环氧灌封材料的新方法，寻求提高其使用性能的有效途径是该领域研究的重要课题。 - This paper mainly described the research on rheological property , high thermal stability , flame retardant , the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials , which greatly apply on electronic equipment and large scale integrated circuit and so forth
摘要本文主要综述了国内外用于电子元器件、大规模集成电路等高科技领域的有机硅灌封材料在流动、耐高温、阻燃和绝缘导热等方面的性能以及催化剂对灌封材料的影响的研究应用进展。 - It's difficult to find encapsulating material in a sentence. 用encapsulating material造句挺难的
- Test results show that that the breakcown voltage and heat distortion temperature the encapsulating materials of epoxy resin with hgh are famously improved , but the the addition of hgh , the viscosities of the epoxy resin - hgh system is higher compared with that of the others and the encapsulating process is effected . nano - sio2 improves the mechanical properties of encapsulating materials of epoxy resin , impact strength reaches 27 . 64kj / m2 from 13 . 95 kj / m2 , flexural strength reaches 136 . 68mpa from64 . 95 mpa . by addition of the montmorillonite , glass transition temperature and heat distortion temperature of the encapsulating materials are 13 . 2 and 16 higher than that of epoxy re
结果表明，活性硅微粉对环氧灌封材料的热变形温度和电学性能提高较为显著，尤其在浸水后，电学性能降低幅度很小，西北工业大学硕士学位论文但活性硅微粉用量较大，材料的工艺性能明显降低;纳米5102对环氧灌封材料具有显著的增强和增韧作用，冲击强度、弯曲强度由原来的13 . 95kj / mz和64 . 95mpa分别提高到27 . 64kjzm2和136 . 68mpa 。